PIR Insulation

Kingspan Thermafloor TF70, a rigid PIR foam insulation board with low emissivity composite foil on both faces, is suitable for the following applications: beam and dense block floors, between floor joists, suspended timber ground floors, between and under floor joists, beam and block floors, concrete based ground floors, and floating ground floors.

Available in thicknesses from 25mm - 165mm.

Has a Thermal Conductivity of 0.022 W/mK, a compressive strength of 140kPa and a Vapour Restistance that typically exceeds 100 MNs/gm.

Kingspan Thermawall TW55, a rigid PIR foam insulation board with low emissivity composite foil on both faces, is suitable for the following applications: timber framing systems, timber sheathing systems, and metal framing sysems.

Available in thicknesses from 25mm - 165mm.

Has a Thermal Conductivity of 0.022 W/mK, a compressive strength of 140kPa and a Vapour Restistance that typically exceeds 100 MNs/gm.

Kingspan Thermaroof TR24, a rigid PIR foam insulation board with bitumen coated glass tissue finished with a thermofusible polypropylene fleece on the upper facing while the lower face is a mineralised glass tissue, is suitable for the following applications: flat roofs waterproofed with most torch on applied waterproofing applications.

Available in thicknesses from 25mm - 150mm.

Has a Thermal Conductivity ranging from 0.026 - 0.024 W/mK, a compressive strength of 150kPa and a Vapour Resistance that typically exceeds 300 MNs/gm.

Kingspan Thermaroof TR26, a rigid PIR foam insulation board with low emissivity foil on both faces, is suitable for the following applications: mechanically fixed waterproofing membranes on concrete, timber, and metal deck as well as green roof systems.

Available in thicknesses from 25mm - 150mm.

Has a Thermal Conductivity of 0.022 W/mK, a compressive strength of 150kPa and a Vapour Restistance that typically exceeds 100 MNs/gm.